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Ion Beam Sputtering Equipment Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Ion Beam Sputtering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. ティー・ケイ・エス Tokyo//Electronic Components and Semiconductors
  2. Bühler K.K. Kanagawa//Food Machinery
  3. アールエムテック Tokyo//Optical Instruments
  4. 4 ハイテック・システムズ Kanagawa//Industrial Machinery
  5. 5 プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
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Ion Beam Sputtering Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Ion Beam Sputtering Device for Precision Optics IBS1400/1600 Bühler K.K.
  2. Remote plasma ion beam sputtering device ティー・ケイ・エス
  3. Small-scale research ion beam sputtering device アールエムテック
  4. Ion beam sputtering device アールエムテック
  5. 4 High Rate Ion Beam Sputtering High-Speed Film Deposition System (HR-PVD) ティー・ケイ・エス

Ion Beam Sputtering Equipment Product List

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Small-scale research ion beam sputtering device

Small-scale research ion beam sputtering device

Experimental device equipped with an ion source, applicable for ultra-thin film multilayer deposition in precision optics.

The "Ion Beam Sputtering Device" from OSI is an experimental device equipped with an ion source that can be customized to meet the usage needs of customers. It demonstrates capabilities equivalent to Veeco's SPECTOR. It uses RF ion sources for sputtering and for assist applications, making it suitable for the deposition of ultra-thin multilayer films in precision optics, equipped with OMS or OTM software. 【Features】 ■ Experimental device equipped with an ion source ■ Equipped with capabilities equivalent to Veeco's SPECTOR ■ Ideal for ultra-thin multilayer film deposition in precision optics with OMS or OTM software ■ Customizable to meet usage needs For more details, please contact us or download the catalog.

  • Sputtering Equipment

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Remote plasma ion beam sputtering device

Remote plasma ion beam sputtering device

We achieve film formation by freely controlling reactive sputtering and alloy sputtering.

Independent current control is performed for the ion source, target, and substrate. With independent control, not only the sputter rate but also various reactive sputtering processes such as oxide and nitride films can be freely controlled. This device strongly supports advanced material research and process development, enabling the deposition of difficult-to-deposit materials such as ferromagnetic films, Co-sputtering of metal and ceramic targets, and dielectric/insulating films from metal targets. Independent control of ion supply and sputter rate → Control of sputter rate, film quality, and crystal structure → Control of ionization rate of target materials High-directionality film deposition → High-directionality film deposition characteristic of ion beam sputtering Multi-target mechanism → Wide-ranging multilayer film deposition Independent control of multiple targets → Co-sputtering alloy deposition by controlling the sputter rate of each target → Multilayer deposition by switching targets Conformal film deposition through bias application control to the substrate → Conformal film deposition even under adverse conditions such as deep trenches and overhangs.

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  • Sputtering Equipment
  • Plasma Generator
  • Other surface treatment equipment

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Production Remote Plasma Ion Beam Sputtering Device

Production Remote Plasma Ion Beam Sputtering Device

Optimal solution for high-rate reactive film deposition production equipment.

By using a helicon plasma source as the ion source, this groundbreaking method accelerates high-density ions obtained from it by applying a bias voltage to the target, achieving high-rate and highly directional film deposition. Independent current control for the ion source, target, and substrate allows for precise control of not only the sputtering rate but also various reactive sputtering processes such as oxide and nitride films. It enables high-rate film deposition of materials that are difficult to deposit with conventional equipment, such as ferromagnetic materials and dielectric/insulating films from metal targets. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieves both high-speed sputtering and low contamination Reduces running costs by improving target utilization efficiency Low maintenance due to gridless structure Sputtering while keeping the substrate at low temperatures through remote plasma configuration ■ Single wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality High-directionality ion beams enable uniform film thickness deposition, resulting in excellent step coverage in film formation.

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  • Sputtering Equipment

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Ion Beam Sputtering Device for Precision Optics IBS1400/1600

Ion Beam Sputtering Device for Precision Optics IBS1400/1600

Beuler-Lieboldt Optics Vacuum IBS Equipment

Rivolt Optics, with nearly 160 years of history as the world's largest vacuum equipment and device manufacturer, has long-standing experience as an industry leader and provides vacuum thin film manufacturing equipment and processes to achieve high-precision optical coatings. We offer a variety of vacuum chamber sizes, from research and development applications to large-scale production equipment, to meet our customers' diverse needs.

  • Other surface treatment equipment

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Ion Beam Sputtering Device 'scia Coat 200/500'

Ion Beam Sputtering Device 'scia Coat 200/500'

Introducing the ion beam sputtering device equipped with a maximum of 5 targets (220mm diameter) or 4 targets (300mm diameter)!

The "scia Coat 200/500" is a product compatible with a maximum of 200mm wafer substrates or 300mm x 500mm substrates. The processes include Ion Beam Sputtering (IBS), Ion Beam Etching (IBE), and Dual Ion Beam Sputtering (DIBS). Please feel free to consult us when needed. 【Features】 ■ Compatible with a maximum of 200mm wafer substrates or 300mm x 500mm substrates ■ Can accommodate up to 5 (220mm diameter) or 4 (300mm diameter) targets ■ RF source (120mm to 350mm) ■ Linear Microwave ECR source (2 x 380mm long) *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment

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Multilayer film deposition ion beam sputtering device for optical filters

Multilayer film deposition ion beam sputtering device for optical filters

It is an ion beam sputtering device for DWDM film deposition.

This is an ion beam sputtering device for the optical field. Sputter: 16cm RF Ion Source Assist: 16cm RF Ion Source Target: 2 surfaces, oscillation function Stage: rotation Film thickness control: transmission-type wavelength-variable laser film thickness control Main exhaust: cryopump or TMP + SUPCOLD For more details, please contact us.

  • Laser Components
  • Other optical parts

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High Rate Ion Beam Sputtering High-Speed Film Deposition System (HR-PVD)

High Rate Ion Beam Sputtering High-Speed Film Deposition System (HR-PVD)

High-rate and high-quality film formation of dielectric and ferromagnetic materials.

This is a high-speed ion beam sputtering (IBD) device that excels in the deposition of dielectrics such as Al2O3 and SiO2, which typically have low deposition rates in conventional magnetron sputtering, as well as ferromagnetic materials like Fe. By using a helicon plasma source as the ion source and a groundbreaking method that accelerates the high-density ions obtained from it through the application of bias voltage to the target, it achieves high-rate and highly directional film deposition. It also contributes to cost reduction in deposition processes using valuable and rare targets by efficiently utilizing the entire target surface. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieving both high-speed sputtering and low contamination Reduction of running costs through improved target utilization efficiency Maintenance reduction due to gridless structure Sputtering while keeping the substrate at low temperature through remote plasma configuration ■ Wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality Uniform film thickness can be achieved with a highly directional ion beam, resulting in excellent step coverage in film deposition.

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  • Sputtering Equipment

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Ferromagnetic film and solid electrolyte film formation solutions

Ferromagnetic film and solid electrolyte film formation solutions

Ion beam sputtering equipment for research and development as well as small-scale production!

The "TFE New Ion Beam Sputtering Series" is a research and development system for small-scale production with a variety of functions, particularly a sputtering solution for ferromagnetic films and solid electrolytes that allows for the formation of ferromagnetic thin films, such as MTJ devices, without plasma damage. Additionally, it is an ion beam sputtering device that achieves good film thickness distribution for solid fuel cell electrolytes. Furthermore, it is a sputtering device that offers the option of manual or automatic load lock, and features complete automatic control via PLC and PC, as well as remote control via the internet. 【Features】 ■ A plasma damage-free process applicable for the deposition of thin films for ferromagnetic elements (MTJ) ■ Excellent film thickness uniformity for solid fuel cell electrolytes (can be equipped with a glove box) ■ Outstanding film thickness uniformity (<2%: 3σ, 200mm wafer) *For more details, please feel free to contact us.

  • Sputtering Equipment

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Plasma Quest Limited Company Introduction

Plasma Quest Limited Company Introduction

Remote source ion beam sputtering device manufacturer for remote plasma sources.

PlasmaQuest is a reputable company with a 25-year history in the development and sales of helicon-type high-density ion sources and related application products. The gridless helicon plasma source generates high-density plasma and continues to provide OEM supply to many equipment manufacturers. Utilizing this high-quality plasma source as an ion source, the groundbreaking "HiTUS" system applies bias to the target, enabling sputtering under various conditions and with different targets. It allows for sputtering of high magnetic targets and high dielectric targets, which are considered difficult with conventional magnetron sputtering devices, as well as co-sputtering using heterogeneous targets such as metals and ceramics, making it suitable for a wide range of applications. The company is equipped to flexibly respond to both research applications and production-scale equipment.

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  • Sputtering Equipment

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Ion beam sputtering device

Ion beam sputtering device

It is an ion beam sputtering (IBS) device that uses an RF ion source and is equipped with a single stage or planetary stage.

We will design the equipment for research and development or mass production according to customer needs. 【Equipment Features】 - Process operating pressure of 10^-2 Pa (around 10^-4 Torr) Capable of high vacuum film deposition - Low contamination - Non-heated film deposition possible - High-density films - Reactive film deposition possible - Ion beam assist can be added - Good control over film thickness and other parameters

  • Sputtering Equipment
  • Other semiconductors
  • magnet

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Contract film formation services (test film formation of high-quality reaction films, etc.)

Contract film formation services (test film formation of high-quality reaction films, etc.)

We will support the exploration of new materials and the development of film formation processes.

HiTUS Technology Independent current control is performed for the ion source, target, and substrate. With independent control, it becomes possible to freely control not only the sputter rate but also various reactive sputtering processes such as oxide films and nitride films. We strongly support advanced materials research and process development for applications that have been considered difficult with conventional sputtering equipment, such as ferromagnetic film deposition, co-sputtering of metal and ceramic targets, and dielectric/insulating film deposition from metal targets.

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  • Other metal materials
  • alloy
  • Surface treatment contract service

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